Thermal-control system of a media-streaming device and associated media-streaming devices

ABSTRACT

This document describes a thermal-control system that is integrated into a media-streaming device. The thermal-control system includes a combination of heat spreaders and materials with high thermal-conductivity. The thermal-control system may spread, transfer, and dissipate energy from a thermal-loading condition effectuated upon the media-streaming device to concurrently maintain temperatures of multiple thermal zones on or within the media-streaming device at or below multiple respective prescribed temperature thresholds.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.17/035,238, filed Sep. 28, 2020, which is hereby incorporated byreference herein in its entirety.

BACKGROUND

Media-streaming devices are widely used to wirelessly stream media to anauxiliary electronic device. As an example, a media-streaming device mayreceive, through a wireless local area network (WLAN), data from amedia-service provider and convert the data to stream video and audiocontent to a television having a display and speakers. In this instance,which is an example of an early-generation media-streaming device,integrated circuit (IC) components may exude a thermal-loading conditionthat can approach 2.5 Watts (W). To manage the thermal-loadingcondition, the media-streaming device may include a thermal-controlsystem that maintains a thermal zone of the media-streaming device to beat or below a single, prescribed temperature threshold. Such athermal-control system may include a single, dedicated heat spreaderthat is made from a stainless-steel material up to 1.0 millimeter (mm)thick.

Media-streaming devices may include high-definition multimedia interface(HDMI) hardware and integrated-circuit (IC) devices that afford advancedfunctionalities over simply receiving and converting data to streamvideo and audio content. In this instance, the SoC IC device may exude athermal-loading condition upon the media-streaming device that canapproach 4.0 W.

The thermal-control system, including the single, dedicated heatspreader made from stainless steel, may have multiple drawbacks managingsuch a thermal-loading condition. As a first example drawback, to becapable of dissipating up to 4.0 W of heat, properly sizing the thickstainless steel heat spreader may result in the media-streaming devicehaving a hanging-weight that damages structures used to connect themedia-streaming device to the auxiliary electronic device (e.g., auniversal serial bus (USB) port of the media-streaming device, an HDMIconnector/structure of the media-streaming device, an HDMI port of theauxiliary electronic device). As a second example drawback, thethermal-control system may lead to uneven spread and transfer of heatwithin the media-streaming device, leading to hot spots that may resultin (i) damage to one or more IC devices of the media-streaming deviceand (ii) a surface of one or more housing components of themedia-streaming device exceeding a prescribed ergonomictouch-temperature limit.

SUMMARY

This document describes a thermal-control system that is integrated intoa media-streaming device. The thermal-control system includes acombination of heat spreaders and materials with highthermal-conductivity. The thermal-control system may spread, transfer,and dissipate energy from a thermal-loading condition effectuated uponthe media-streaming device to concurrently maintain temperatures ofmultiple thermal zones on or within the media-streaming device at orbelow prescribed temperature thresholds.

In some aspects, a thermal-control system for a media-streaming deviceand associated media streaming devices is described. The thermal-controlsystem includes a first thermal-control subsystem having a firstgraphite sheet that is fixed to a first generally concave interiorsurface of a first housing component and a first heat spreader that isseparated from the first graphite sheet by a first air gap. The firstthermal-control subsystem further includes a first thermal interfacematerial (TIM) located between the first heat spreader and a first ICdevice mounted to a first generally planar surface of a PCB.

The thermal-control system also includes a second thermal-controlsubsystem having a second graphite sheet that is fixed to a secondgenerally concave interior surface of a second housing component, wherethe second generally concave interior surface of the second housingcomponent faces the first generally concave interior surface of thefirst housing component. The second thermal-control subsystem furtherincludes a second heat spreader that is separated from the secondgraphite sheet by a second air gap. A second thermal interface materialis located between the second heat spreader and a second IC device thatis mounted to a second surface of the PCB that is opposite the firstsurface of the PCB.

In other aspects, a media-streaming device is described. Themedia-streaming device includes a housing having a first housingcomponent that is joined to a second housing component. Themedia-streaming device also includes an SoC IC device mounted to a firstsurface of a printed circuit board (PCB) that is positioned within thehousing. A thermal-control system, also positioned within the housing,is configured to maintain temperatures throughout the media-streamingdevice during a thermal-loading condition. During the thermal-loadingcondition, the thermal-control system concurrently maintains (i) a firsttemperature of a first thermal zone including the SoC IC device at orbelow a first prescribed temperature threshold, (ii) a secondtemperature of a second thermal zone including a second surface of thePCB at or below a second prescribed temperature threshold, (iii) a thirdtemperature of a third thermal zone including a first exterior surfaceof the first housing component at or below a third prescribedtemperature threshold, and (iv) a fourth temperature of a fourth thermalzone including a second exterior surface of the second housing componentat or below a fourth prescribed temperature threshold.

The details of one or more implementations are set forth in theaccompanying drawings and the following description. Other features andadvantages will be apparent from the description, the drawings, and theclaims. This summary is provided to introduce subject matter that isfurther described in the Detailed Description. Accordingly, a readershould not consider the summary to describe essential features nor limitthe scope of the claimed subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

The details of one or more aspects of a thermal-control system for amedia-streaming device are described below. The use of the samereference numbers in different instances in the description and thefigures indicate similar elements:

FIG. 1 illustrates an operating environment having an examplemedia-streaming device connected to a television.

FIG. 2 illustrates an exploded, isometric view of an examplemedia-streaming device in accordance with one or more aspects.

FIG. 3 illustrates a cross-section view of an example media-streamingdevice having a thermal-control system.

FIG. 4 illustrates a top view of an example graphite sheet that is fixedto an interior surface of a housing component.

FIG. 5 illustrates a top view of another example graphite sheet that isfixed to an interior surface of another housing component.

FIG. 6 illustrates a top view of a housing component, including anexample thermal impact of a heat spreader located near the housingcomponent.

FIG. 7 illustrates a cross-section view of a media-streaming device,including an example thermal-stacking configuration of a thermal-controlsystem.

FIG. 8 illustrates a cross-section view of a media-streaming device,including another example thermal-stacking configuration of athermal-control system.

FIG. 9 illustrates example details of multiple thermal zones across amedia-steaming device.

DETAILED DESCRIPTION

This document describes a thermal-control system that is integrated intoa media-streaming device. The thermal-control system is lightweight andincludes a combination of heat spreaders and low thermal-resistancematerials. The thermal-control system may spread, transfer, anddissipate energy from a thermal-loading condition effectuated upon themedia-streaming device to concurrently maintain temperatures of multiplethermal zones on or within the media-streaming device at or belowmultiple, respective prescribed temperature thresholds.

While features and concepts of the described thermal-control system canbe implemented in any number of different environments and devices,aspects are described in the context of the descriptions and examplesbelow.

Heat transfer, in general, is energy that is in transit due to atemperature difference. If one or more temperature differences existacross components of a system, such as the media-streaming device, heat(e.g., energy in Joules (J)) will transfer from higher temperature zonesto lower temperature zones to reduce the temperature differences. Thereare several mechanisms for heat transfer across the components of thesystem to minimize temperature differences, including convection,radiation, and conduction.

Convection, or heat transfer from a surface due to movement of moleculeswithin fluids such as gases and liquids, may be quantified by equation(1) below:

q _(conv) =hA(T _(s) −T _(∞))  (1)

For equation (1), qconv represents a rate of heat transfer from asurface through convection (e.g., in J per second or Watts (W)), hrepresents a convection heat transfer coefficient (e.g., in W per metersquared (W/m2)), Ts represents a temperature of a surface (e.g., inKelvin (K) or degrees Celsius (° C.)), and T∞ represents a temperatureof a fluid (e.g., in K or ° C.) to which the surface is exposed. Theterm A represents an area of a surface (e.g., in m2).

Radiation, or heat transfer from a surface through electromagneticradiation, may be quantified by equation (2) below:

q _(rad) =εAσ(T _(s) ⁴ −T _(surr) ⁴)  (2)

For equation (2), grad represents a rate of heat transfer throughradiation (e.g., in W), ε represents emissivity (dimensionless), σrepresents the Stefen-Boltzmann constant (e.g., σ=5.67×10−8 W/(m2·K4)),Ts represents a temperature of a surface (e.g., in K or ° C.), and Tsurrrepresents a temperature of surroundings of the surface (e.g., in K or °C.). The term A represents an area of the surface (e.g., in m2).

Conduction, or heat transfer through a solid body through atomic andmolecular activity, may be quantified by equation (3) below:

$\begin{matrix}{q_{cond} = {{- {kA}}\frac{dt}{dx}}} & (3)\end{matrix}$

For equation (3), qcond represents a rate of heat transfer in a solidmaterial through conduction (e.g., in W), k represents a highthermal-conductivity of the solid material (e.g., in W/(m·K)), and dT/dxrepresents a temperature gradient through the solid material (e.g., inK/m or ° C./m). The term A represents a cross-sectional area of thesolid material (e.g., in m2).

A media-streaming device may include a thermal-control system thattransfers heat using one or more of the mechanisms described above. Ingeneral, and in accordance with equations (1) and (2), rates and/orquantities of heat transfer can be varied by increasing or decreasingsurface areas for convection and/or radiation within the media-streamingdevice (e.g., increasing or decreasing surface areas of heat spreadingmechanisms).

In accordance with equation (3) and within the thermal-control system,rates and/or quantities of heat transfer can also be varied byintroducing, between surfaces, one or more TIMs that have a highthermal-conductivity. Through careful implementation of heat spreadersand the use of TIMs having a high thermal-conductivity, thethermal-control system can concurrently maintain temperatures ofdifferent thermal zones at or below different prescribed temperaturethresholds during a thermal-loading condition.

Through conduction, convection, and radiation, as described above, thethermal-control system may transfer heat (e.g., energy) originating fromwithin the media-streaming device to housing components (e.g., externalskins) for dissipating to the external environment through convectionand/or radiation. Temperature variation across the surfaces of thehousing components, in general, decreases as the quality of thethermal-control system improves. A dimensionless metric that is known asthe Coefficient of Thermal Spreading (CTS) quantifies this quality andmay be given by equation (4) below:

$\begin{matrix}{{CTS} = {\frac{\theta_{ave}}{\theta_{\max}} = {( {T_{ave} - T_{ambient}} )/( {T_{\max} - T_{ambient}} )}}} & (4)\end{matrix}$

For equation (4), CTS is a dimensionless metric that ranges from 0 to 1.The equation is a ratio of the average temperature rise on a surface toa peak temperature rise on the surface, where Tave (e.g., the averagetemperature across the surface), Tmax (e.g., the maximum temperature ata location on the surface), and Tambient (e.g., the surrounding ambienttemperature) can be measured in K or ° C. As the quality of athermal-control system improves, this ratio approaches unity.

As a contrasting example, the thermal-control system of amedia-streaming device (as described earlier) may result in themedia-streaming device having a CTS that is equal to approximately 0.50.As described herein, however, the thermal-control system may result inthe media-streaming device having a CTS that approaches approximately0.90.

FIG. 1 illustrates an operating environment 100 having an examplemedia-streaming device 102 connected to a television 104. Althoughillustrated as being connected to the television 104, themedia-streaming device 102 may be connected to other types of deviceshaving a display and/or audio capability (e.g., a tablet, a notebook, alaptop, a computing device, a projector).

In the operating environment 100, multiple IC devices are generating aninternal heat load 106 (e.g., qi) within the media-streaming device 102.As an example, the internal heat load 106 may be generated within themedia-streaming device at a rate of up to 4 W.

In addition to an SoC IC device, the multiple IC devices may include amemory IC device and/or a wireless-communication IC device (e.g., awireless-communication IC device for wirelessly communicating inaccordance with an IEEE 802.11 wireless-communication protocol (Wi-Fi),a Fifth-Generation New Radio (5GNR) protocol, and so on). The multipleIC devices, in conjunction with HDMI hardware that may be part of themedia-streaming device 102, may support interactions with multiplestreaming applications, support wireless-connectivity across differentwireless-communication protocols, interact with a remote control, andexecute an operating system to control a digital media player, a set-topbox, a soundbar, and/or a television.

The media-streaming device 102 includes a thermal-control system 108.The thermal-control system 108 includes an SoC IC device thermal-controlsubsystem 110 and an other IC device(s) thermal-control subsystem 112.The SoC IC device thermal-control subsystem 110 may be a firstthermal-control subsystem that is in thermal contact with an SoC ICdevice of the media-streaming device 102. The other IC device(s)thermal-control subsystem 110 may be a second thermal-control subsystemthat is in thermal contact with other IC devices of the media-streamingdevice 102 (e.g., a memory IC device, a wireless-communication ICdevice, and so on).

In general, the thermal-control system 108 (e.g., the SoC IC devicethermal-control subsystem 110 in conjunction with the other IC device(s)thermal-control subsystem 112) may spread and transfer energy from athermal-loading condition (e.g., the internal heat load 106) effectuatedupon the media-streaming device 102 to concurrently maintaintemperatures of multiple thermal zones within the media-streaming device102 at or below multiple, respective temperature thresholds. Thethermal-control system 108 may transfer heat for external dissipationthrough multiple surfaces of the media-streaming device 102. As anexample, and in some instances, the externally dissipated heat 114through two surfaces of the media-streaming device may be equal to theinternal head load (e.g., qds1+qds2=qi).

FIG. 2 illustrates an exploded isometric view 200 of the media-streamingdevice 102 of FIG. 1 . The media-streaming device 102 includes an SoC ICdevice 202 that is mounted to a first surface 204 of a PCB 206. The SoCIC device 202 may include logic and/or memory integrated circuitry thatprocesses data to render video and/or audio content for streaming to atelevision (e.g., the television 104 of FIG. 1 ). As part of processingthe data to render the video and/or audio content, the SoC IC device 202may contribute to the internal heat load 106. The PCB 206 includes asecond surface 208, to which one or more other IC devices (e.g., awireless-communication IC device, a memory IC device, passive resistors,and/or capacitor IC devices, and so on, which are not visible in FIG. 2) are mounted.

The media-streaming device 102 further includes a first housingcomponent 210 and a second housing component 212. The second housingcomponent 212 is substantially complementary to the first housingcomponent 210. In general, the first housing component 210 and thesecond housing component 212 may join to form an assembled housing forthe media-streaming device 102. The shape of the media-streaming device102 (e.g., when the first housing component 210 and the second housingcomponent 212 are joined to form the assembled housing) may be an oblatespheroid.

The media-streaming device 102 includes the thermal-control system 108having two thermal-control subsystems (e.g., the SoC IC devicethermal-control subsystem 110 and the other IC device(s) thermal-controlsubsystem 112). The SoC IC device thermal-control subsystem 110 mayinclude a combination of heat spreaders and low thermal-resistancematerials to concurrently spread and transfer energy (e.g., heat)throughout the media-streaming device 102 for eventual dissipation. Asillustrated in FIG. 2 , the SoC IC device thermal-control subsystem 110includes a first graphite sheet 214 that adheres to a first generallyconcave interior surface 216 of the first housing component 210. The SoCIC device thermal-control subsystem 110 also includes a first heatspreader 218 and one or more first TIM(s) 220. In some instances, atleast one of the first TIM(s) 220 may be located between, and in thermalcontact with, the SoC IC device 202 and the first heat spreader 218.Furthermore, and in some instances, the first heat spreader 218 mayinclude flanges, holes, and/or pins to align the first heat spreader 218to the PCB 206. In addition, the first heat spreader 218 may include oneor more subassemblies (e.g., multiple conductive elements combined torender the first heat spreader 218).

The other IC device(s) thermal-control subsystem 112 may include anothercombination of heat spreaders and low thermal-resistance materials toconcurrently spread and transfer energy (e.g., heat) throughout themedia-streaming device 102 for eventual dissipation. The other ICdevice(s) thermal-control subsystem 112 may include a second graphitesheet 222 that adheres to a second generally concave interior surface224 of the second housing component 212. The other IC device(s)thermal-control subsystem 112 also includes a second heat spreader 226and one or more second TIM(s) 228. In some instances, at least one ofthe second TIM(s) 228 may be located between an IC device (notillustrated in FIG. 1 ) and the second heat spreader 226. Furthermore,and in some instances, the second heat spreader 226 may include flanges,holes, and/or pins to align the second heat spreader 226 to the PCB 206.Furthermore, and in some instances, the second heat spreader 226 mayinclude one or more subassemblies (e.g., multiple conductive elementscombined to render the second heat spreader 226).

In general, the thermal-control system 108 dissipates energy (e.g., heatfrom the internal heat load 106 of FIG. 1 ) using convection andradiation heat transfer modes throughout the media-streaming device 102for eventual dissipation to a surrounding environment. Dissipation mayoccur through the first exterior surface 230 of the first housingcomponent 210 or through the second exterior surface 232 of the secondhousing component 212, or through both the first exterior surface 230 ofthe first housing component 210 and the second exterior surface 232 ofthe second housing component 212.

FIG. 3 illustrates a cross-section view 300 of an examplemedia-streaming device including elements of a thermal-control system.The media-streaming device may be the media-streaming device 102 of FIG.1 .

The thermal-control system includes a first air gap 302 and a second airgap 304. In general, the first air gap 302 and the second air gap 304may contribute to thermal resistances within the thermal-control system.

In FIG. 3 , the first graphite sheet 214 is fixed to the first generallyconcave interior surface 216 of the first housing component 210. Thefirst housing component 210 may include a plastic material. In someinstances, the first graphite sheet 214 may be a hybrid graphite sheetthat includes a layering of one or more films that each include agraphite material, a pressure-sensitive adhesive (PSA) material, or apolyethylene terephthalate (PET) material.

The first air gap 302, as illustrated, is located between the firstgraphite sheet 214 and the first heat spreader 218. Also, asillustrated, the first TIM 220 is located between, and in thermalcontact with, the first heat spreader 218 and the SoC IC device 202. Byreducing air gaps and/or bond line gaps at respective surfaces of theSoC IC device 202 and the first heat spreader 218, the first TIM 220improves high thermal-conductivity and increases an efficiency and aneffectiveness with which the SoC IC device 202 and the first heatspreader 218 exchange heat.

The first TIM 220, in some instances, may include a first thermal gelmaterial (e.g., a thermally conductive gel material) that includes asilicone-rubber material injected with nanoparticles such as aluminumnanoparticles. The first TIM 220 may, in other instances, include athermal pad material that includes a preformed solid material that issilicone or paraffin wax-based.

The first heat spreader 218, in some instances, may be enhanced with oneor more first recess(es) 306 that can mitigate a hot spot. In someinstances, the first heat spreader 218 may be formed from an aluminummaterial that is less than or equal to 0.20 mm thick.

As illustrated in FIG. 3 , the first heat spreader 218 includes thefirst recess 306 on one surface (e.g., surface facing the first graphitesheet 214) and a corresponding first protrusion 308 formed on anopposing surface (e.g., surface facing the PCB 206). The first recess306 forms a cavity with an opening that is exposed to (and faces) thefirst graphite sheet 214 while the first protrusion 308 is in thermalcontact with the first TIM 220. An area of the first protrusion 308 thatis in thermal contact with the first TIM 220 may be approximate to, orlarger than, another area corresponding to a surface area of the firstTIM 220.

If the first heat spreader 218 includes the first recess 306,origination of thermal convection and/or radiation from the first heatspreader 218 to the first graphite sheet 214 may change from a focusedregion (e.g., the “hot spot” corresponding a surface area of SoC ICdevice 202) to an annular ring (e.g., the “hot ring”) that has an areathat is larger than that of the focused region. This may, in someinstances, improve heat transfer to, and heat transfer throughout, thefirst graphite sheet 214 to improve an efficiency of heat transfer fromthe first graphite sheet 214 to the first housing component 210.

In some instances, the first heat spreader 218 may be integrated as aportion of a first electromagnetic interference (EMI) shield structure310 that is within the media-streaming device 102. In such an instance,a first thermally-conductive foam material 312 may be located between,and be in thermal contact with, the first heat spreader 218 and anotherportion of the first EMI shield structure 310. Moreover, the first heatspreader 218 may also perform EMI-shielding functions (in addition toheat-spreading functions). In general, by integrating the first heatspreader 218 as a portion of the first EMI shield structure 310, thehanging-weight of the media-streaming device 102 may be reduced.

FIG. 3 also illustrates the second graphite sheet 222 fixed to thesecond generally concave interior surface 224 of the second housingcomponent 212. The second housing component 212 may include a plasticmaterial. In some instances, the second graphite sheet 222 may be ahybrid graphite sheet that includes a layering of one or more films thatinclude a graphite material, a PSA material, or a PET material.

The second air gap 304, as illustrated, is located between the secondgraphite sheet 222 and the second heat spreader 226. As furtherillustrated, the second TIM 228 is located between, and in thermalcontact with, the second heat spreader 226 and an IC device 314 (e.g.,an IC device that is other than the SoC IC device 202, such as a memoryIC device, a wireless-communication IC device, and so on). By reducingair gaps and/or bond line gaps at respective surfaces of the IC device314 and the second heat spreader 226, the second TIM 228 improves highthermal-conductivity and increases an efficiency and an effectivenesswith which an IC device 314 and the second heat spreader 226 exchangeheat. The second TIM 228, in some instances, may include a thermal gelmaterial (e.g., a thermally conductive gel material) that includes asilicone-rubber material injected with nanoparticles such as aluminumnanoparticles. The second TIM 228 may, in other instances, be a thermalpad, including a preformed solid material that is silicone or paraffinwax-based.

The second heat spreader 226, in some instances, may be enhanced withone or more second recess(es) 316 that can transform a “hot spot” into a“hot ring.” In some instances, the second heat spreader 226 may beformed from an aluminum material that is less than or equal to 0.20 mmthick.

As illustrated in FIG. 3 , the second heat spreader 226 includes thesecond recess 316 on one surface (e.g., surface facing the secondgraphite sheet 222) and a corresponding second protrusion 318 formed onan opposing surface (e.g., surface facing the PCB 206). The secondrecess 316 forms a cavity with an opening that is exposed to (and faces)the second graphite sheet 222 while the second protrusion 318 is inthermal contact with the second TIM 228. An area of the secondprotrusion 318 that is in thermal contact with the second TIM 228 may beapproximate to, or larger than, another area corresponding to a surfacearea of the second TIM 228.

If the second heat spreader 226 includes the second recess 316,origination of thermal convection and/or radiation from the second heatspreader 226 to the second graphite sheet 222 may change from a focusedregion (e.g., the hot spot corresponding to a surface area of the ICdevice 314) to an annular ring (e.g., the hot ring) that has an areathat is larger than that of the focused region. This may, in someinstances, improve heat to, and heat transfer throughout, the secondgraphite sheet 222 to improve an efficiency of heat transfer from thesecond graphite sheet 222 to the second housing component 212.

In some instances, the second heat spreader 226 may be integrated as aportion of a second EMI shield structure 320 that is within themedia-streaming device 102. In such an instance, a second thermallyconductive foam material 222 may be located between, and be in thermalcontact with, the second heat spreader 226 and another portion of thesecond EMI shield structure 320. Moreover, the second heat spreader 226may also perform EMI-shielding functions (in addition to heat-spreadingfunctions). In general, by integrating the second heat spreader 226 as aportion of the second EMI shield structure 320, the hanging-weight ofthe media-streaming device 102 may be reduced.

Also illustrated in FIG. 3 are a USB port 322 and an HDMIconnector/cable structure 324. By reducing the hanging-weight of themedia-streaming device 102 (e.g., by integrating the first heat spreader218 as part of the first EMI shield structure 310 and integrating thesecond heat spreader 226 as part of the second EMI structure 320),damage to a USB port 322 and/or an HDMI connector/cable structure 324may be avoided.

FIG. 4 illustrates a top view 400 of an example graphite sheet that isfixed to a housing component. The graphite sheet may be the firstgraphite sheet 214 and may be fixed to an interior surface of the firsthousing component 210 of FIGS. 1 and 2 (e.g., fixed to the firstgenerally concave interior surface 216 as illustrated in FIGS. 1 and 2).

As illustrated by FIG. 4 , the first graphite sheet 214 may have a firstfootprint 402 that excludes first antenna area 404 of the first housingcomponent 210. The first antenna area 404 enables electromagnetic waves(e.g., wireless communications) to be transmitted or received byantennas of a wireless-streaming device without interference from thefirst graphite sheet 214. Also, as illustrated by FIG. 3 , the firstfootprint 402 of the first graphite sheet 214 excludes first structuralarea 406 of the first housing component 210. The first structural area406 enables assembling the first housing component 210 to anotherhousing component without interference from hardware (screws, fasteners,etc.).

FIG. 5 illustrates a top view 500 of another example graphite sheet thatis fixed to a housing component. The graphite sheet may be the secondgraphite sheet 222 and may be fixed to an interior surface of the secondhousing component 212 of FIGS. 1 and 2 (e.g., fixed to the secondgenerally concave interior surface 224 as illustrated in FIGS. 1 and 2).

As illustrated by FIG. 5 , the second graphite sheet 222 may have asecond footprint 502 that excludes a second antenna area 504 of thesecond housing component 212. The second antenna area 504 enableselectromagnetic waves (e.g., wireless communications) to be transmittedor received by antennas of a wireless-streaming device withoutinterference from the second graphite sheet 222. Also, as illustrated byFIG. 5 , the second footprint 502 of the second graphite sheet 222excludes second structural area 506 of the second housing component 212.The second structural area 506 enables assembling the second housingcomponent to another housing component without interference fromhardware (screws, fasteners, etc.).

FIG. 6 illustrates a top view 600 of the first housing component 210,including and an example thermal impact of the first heat spreader 218located near the second housing component 212. The first heat spreader218 is located within the first housing component 210 (e.g., facing thefirst graphite sheet 214 and the first generally concave interiorsurface 216 of the first housing component 210 as illustrated in FIGS. 2and 3 ).

As illustrated, the first recess 306 (illustrated with a hidden, dashedline) corresponds to a hot spot 602. Without the first recess 306incorporated as part of the first heat spreader 218, a temperature ofthe hot spot 602 may exceed a prescribed temperature threshold (e.g., anallowable ergonomic touch temperature) of the first housing component210. However, the recess 306 may, in certain instances, increase adimension of an air gap (e.g., the first air gap 302 of FIG. 3 ) toincrease a thermal resistance and divert heat transfer from within therecess 306. This can result in annular region 604 (e.g., a “ring”),effectuating a distribution of heat across a greater area of the housingcomponent 210 to lower the temperature.

FIG. 7 illustrates a cross-section view 700 of the media-streamingdevice 102, including an example thermal-stacking configuration of athermal-control system. In general, an internal thermal-stackingconfiguration (e.g., a specific arrangement of energy-transfermechanisms such as heat spreaders, graphite sheets, TIMS, and/or airgaps) can influence how heat transfers to surfaces of themedia-streaming device 102 (e.g., the first exterior surface 230 of thefirst housing component 210 and the second exterior surface 232 of thesecond housing component 212) for dissipation to a surroundingenvironment. Without a proper internal thermal-stacking configuration,and due to high power dissipation of some components (e.g., the SoC ICdevice 202), temperatures for portions of the media-streaming device 102may run at temperatures that are higher than other temperatures of otherportions of the media-streaming device 102 during a thermal-loadingcondition. In general, a symmetrical, internal thermal-stackingconfiguration within the media-streaming device 102 may result inineffective and inefficient heat transfer from the media-streamingdevice 102.

As previously described by equation (4), reducing temperaturedifferences across exterior surfaces of the media-streaming device 102can improve an efficiency and effectiveness of heat transfer from themedia-streaming device 102 to a surrounding environment. Reducingtemperature differences across the exterior surfaces improves the CTSof, and heat transfer from, the media-streaming device.

As illustrated by FIG. 7 , the internal thermal-stacking configurationis asymmetrical. The first air gap 302 separates the first heat spreader218 and the first graphite sheet 214 by a first distance 702. The secondair gap 304 separates the second heat spreader 226 and the secondgraphite sheet 222 by a second distance 704. In this instance, the firstdistance 702 may be greater than the second distance 704, effective toincrease thermal resistance of a heat flow path between the SoC ICdevice 202 and the first exterior surface 230 of the first housingcomponent 210. In some instances, this may decrease a rate of heattransfer from the SoC IC device 202 to the first housing component 210and increase another rate of heat transfer from the SoC IC device 202 tothe second housing component 212, balancing temperatures of exteriorsurfaces of the first housing component 210 and the second housingcomponent 212 (e.g., the first exterior surfaces 230 and 232,respectively).

FIG. 8 illustrates a cross-section view 800 of the media-streamingdevice 102, including another example thermal-stacking configuration ofa thermal-control system. As illustrated by FIG. 8 , a portion of theinternal thermal-stacking configuration includes the first TIM 220, thefirst heat spreader 218, and the first graphite sheet 214 that maytransfer a quantity of heat from the SoC IC device 202 to the firstexterior surface 230 of the first housing component 210 for dissipation.

FIG. 8 also illustrates another portion of the internal thermal-stackingconfiguration, which includes the second TIM 228, the second heatspreader 226, the second graphite sheet 222, and one or more thirdTIM(s) 802. The one or more third TIM(s) 802, located between the secondheat spreader 226 and the second graphite sheet 222, may provide athermal conduction path between the second heat spreader 226 and thesecond graphite sheet 222, effective to reduce thermal resistance of aheat flow path between the IC device 314 and the second exterior surface232 of the second housing component 212. In some instances, this mayincrease a rate of heat transfer from the SoC IC device 202 to thesecond housing component 212 and decrease another rate of heat transferfrom the IC device 314 to the first housing component 210, substantiallybalancing the temperatures of exterior surfaces of the first housingcomponent 210 and the second housing component 212 (e.g., the firstexterior surfaces 230 and 232, respectively).

FIG. 9 illustrates example details 900 of multiple thermal zones acrossthe media-streaming device 102. FIG. 9 includes a schematic of thethermal-control system 108. The schematic, also referred to as a thermalcircuit diagram, depicts sources of thermal loading and paths for heattransfer within the media-streaming device 102. In general, thethermal-control system 108 may spread and transfer energy from athermal-loading condition (e.g., the internal heat load 106) effectuatedupon the media-streaming device 102 to concurrently maintaintemperatures of the multiple thermal zones within the media-streamingdevice 102 at or below multiple respective temperature thresholds.

The multiple thermal zones include a first thermal zone 902 thatincludes the SoC IC device 202. The first thermal zone 902 may have afirst prescribed temperature threshold corresponding to an allowablejunction temperature of a diode within the SoC IC device 202 under thethermal-loading condition (e.g., the internal heat load 106 exuding heatat a rate of up to 4 W upon the media-streaming device 102). As anexample, the first prescribed temperature threshold may be approximately95° C. In such an instance, the thermal-control system 108 may spreadand transfer energy (e.g., heat) throughout the media-streaming device102 to maintain the first thermal zone 902 at or below the firstprescribed temperature threshold (e.g., the junction temperature of thediode within the SoC IC device 202 may be maintained at or below 95° C.under the thermal-loading condition).

The multiple thermal zones also include a second thermal zone 904 havingthe second surface 208 of the PCB 206. The second thermal zone 904 mayhave a second prescribed temperature threshold that may be approximately85° C. In such an instance, the thermal-control system 108 may spreadand transfer energy (e.g., heat) throughout the media-streaming device102 to maintain the second thermal zone 904 at or below the secondprescribed temperature threshold (e.g., an allowable surface temperatureof the second surface 208 of the PCB 206 at or below 85° C.).

A third thermal zone 906 that includes the first housing component 210is also part of the multiple thermal zones. The third thermal zone 906may have a third prescribed temperature threshold corresponding to afirst allowable ergonomic touch temperature of the first exteriorsurface 230 of the first housing component 210. As an example, the thirdprescribed temperature threshold may be approximately 72° C. In such aninstance, the thermal-control system 108 may concurrently spread andtransfer energy (e.g., heat) throughout the media-streaming device 102to maintain the third thermal zone 906 at or below the third prescribedtemperature threshold (e.g., the first allowable ergonomic touchtemperature of the first exterior surface 230 of first housing component210 may be maintained at or below 72° C. under the high thermal-loadingcondition).

A fourth thermal zone 908 including the second housing component 212 isalso part of the multiple thermal zones. The fourth thermal zone 908 mayhave a fourth prescribed temperature threshold corresponding to a secondallowable ergonomic touch temperature of the second exterior surface 232of the second housing component 212. As an example, the fourthprescribed temperature threshold may be approximately 72° C. In such aninstance, the thermal-control system 108 may spread and transfer energy(e.g., heat) throughout the media-streaming device 102 to maintain thefourth thermal zone 908 at or below the fourth prescribed temperaturethreshold (e.g., the second allowable ergonomic touch temperature of thesecond exterior surface 232 of the second housing component 212 may bemaintained at or below 72° C. under the high thermal-loading condition).

The thermal-control system 108 may concurrently transfer and spreadenergy (e.g., heat from the internal heat load 106) using convection andradiation heat transfer throughout the media-streaming device. The heatmay subsequently be dissipated through the first exterior surface 230 ofthe first housing component 210 and the second exterior surface 232 ofthe second housing component 212. In general, the thermal-control system108 may concurrently maintain temperatures of the four thermal zones(902, 904, 906, 908) at or below respective prescribed temperaturethresholds. Furthermore, the thermal-control system 108 may be a passivethermal-control system (e.g., absent fans, pumps, or other activeheat-transfer mechanisms).

In some instances, and as quantified by equation (4) described above, aneffective CTS of the thermal-control system 108 may balance a rate ofheat dissipated from a first surface (e.g., qds1 912) and a rate of heatdissipated from a second surface (e.g., qds2 910) such that a differencein temperature between the third thermal zone 906 and the fourth thermalzone 908 (e.g., the difference in temperature between the first exteriorsurface 230 of the first housing component 210 and the second exteriorsurface 232 of the second housing component 212) may be less than 2° C.

In some instances, the thermal-control system 108 may include elementsof the SoC IC device thermal-control subsystem 110. For example, thethermal-control system 108 may include one or more of the first graphitesheet 214, the first heat spreader 218, or the first TIM(s) 220.

In addition, and in some other instances, the thermal-control system 108may include elements of the other IC device(s) thermal-control subsystem112. For example, the thermal-control system 108 may include one or moreof the second graphite sheet 222, the second heat spreader 226, or thesecond TIM(s) 228.

Although techniques using and apparatuses for a thermal-control systemof a media-streaming device are described, it is to be understood thatthe subject of the appended claims is not necessarily limited to thespecific features or methods described. Rather, the specific featuresand methods are disclosed as example ways in which a thermal-controlsystem of a media-streaming device can be implemented.

What is claimed is:
 1. A thermal-control system for a media device, thethermal-control system comprising: a graphite sheet, the graphite sheetfixed to an interior surface of a housing component; a heat spreader,the heat spreader separated from the graphite sheet by an air gap; and athermal interface material, the thermal interface material locatedbetween the heat spreader and an integrated circuit device mounted to asurface of a printed circuit board.
 2. The thermal-control system ofclaim 1, wherein the heat spreader includes a recess forming a cavityand wherein the cavity has an opening facing the graphite sheet.
 3. Thethermal-control system of claim 1, wherein the graphite sheet includes alayer of one or more films that include a graphite material, apressure-sensitive adhesive material, or a polyethylene terephthalatematerial.
 4. The thermal-control system of claim 1, wherein the graphitesheet is formed around an antenna area of the media device.
 5. Thethermal-control system of claim 1, wherein the heat spreader isintegrated as part of an electromagnetic interference shield structuresurrounding the integrated circuit device and wherein the integratedcircuit device is a system-on-chip integrated circuit device.
 6. Thethermal-control system of claim 1, wherein a thermally conductive foamis formed between the heat spreader and the electromagnetic interferenceshield structure.
 7. The thermal-control system of claim 1, wherein theinterior surface of the housing component is a concave interior surface.8. The thermal-control system of claim 1, further comprising: a firstthermal-control subsystem that includes the graphite sheet, the heatspreader, and the thermal interface material; and a secondthermal-control subsystem comprising a second graphite sheet, a secondheat spreader, and a second thermal interface material.
 9. Thethermal-control system of claim 8, wherein the second graphite sheet isfixed to a second interior surface of a second housing component. 10.The thermal-control system of claim 9, wherein the second interiorsurface of the second housing component facing the interior surface ofthe housing component.
 11. The thermal-control system of claim 9,wherein the second graphite sheet has a footprint that excludes astructural area of the media device and enables assembling the secondhousing component to the housing component without interference fromhardware.
 12. The thermal-control system of claim 9, wherein the secondinterior surface of the second housing component is a second concaveinterior surface.
 13. The thermal-control system of claim 8, wherein thesecond graphite sheet includes a later of one or more films, the one ormore films including a graphite material, a pressure-sensitive adhesivematerial, or a polyethylene terephthalate material.
 14. Thethermal-control system of claim 8, wherein the second heat spreaderseparated from the second graphite sheet by a second air gap.
 15. Thethermal-control system of claim 14, wherein the air gap and the secondair gap are asymmetrical.
 16. The thermal-control system of claim 8,wherein the second heat spreader is integrated as part of a secondelectromagnetic interference shield structure.
 17. The thermal-controlsystem of claim 8, wherein the second heat spreader includes an aluminummaterial that is approximately 0.20 millimeters thick.
 18. Thethermal-control system of claim 8, wherein the second thermal interfacematerial is located between the second heat spreader and a secondintegrated circuit device that is mounted to a second surface of theprinted circuit board, the second surface of the printed circuit boardopposite the surface.
 19. The thermal-control system of claim 8, whereina third thermal interface material is formed between the heat spreaderand the graphite sheet.
 20. The thermal-control system of claim 8,wherein a third thermal interface material is formed between the secondheat spreader and the second graphite sheet.